Process
At Bhuwalka Castings we follow two manufacturing processes. One is the Conventional Molding system using Wooden, Aluminium & Thermocole patterns — suited to customers who need high volumes of the same parts on a regular basis. The other is the Full Mould Process (Lost Foam), where a thermocole pattern is consumed during the process — suited to customers without repeated requirements for the same part, and to project-based work and parts of higher complexity.
Conventional Molding Process
Conventional Molding is a metal casting process characterized by using sand as the mold material. Molds are made of sand mixed with resin to develop the strength and plasticity needed for molding, and are contained in mold boxes. The mold cavities and gating system are created by compacting the sand around wooden or aluminium patterns. The same pattern is reused for repetitive molds.
Advantages of Sand Casting
- Suitable for mass production.
- Versatile — size, weight and shape.
- Faster — no need to manufacture tooling for every casting.
- One-time tooling cost.
Disadvantages of Sand Casting
- Variation in dimensional accuracy & casting weight.
- Pattern maintenance.
Full Mould Process (Lost Foam)
Full-mould casting is an evaporative-pattern casting process. It uses an expanded polystyrene foam pattern, which is then surrounded by sand, much like sand casting. The metal is poured directly into the mould, vaporizing the foam on contact.
Advantages of Full-Mould Process
- Supports complex shapes.
- Highly accurate.
- Highly efficient (produces little or no waste).
- Costs less than traditional wax-based casting processes.
- Doesn't require draft or flash.
- Supports a variety of sizes, ranging up to several tons.
- Can be used with molten aluminium, steel, iron, copper, alloys and many other metals.
Disadvantages of Full-Mould Process
- Pattern is consumed during the process.
- A new pattern is required for every new casting.
- While inexpensive at high volumes, full-mould casting typically costs more than other processes for low-volume applications.